Waferpad Technology JP-X finishing pads are specially designed for InP and GaAs wafer final polish. JP-X final pads are made of polyurethane as main material and the following processing coating, grind and buffing are used to make deep, wide and open pore on the pad surface, it can carry adequate chemical slurry and can get smoother finish surface and avoid any light scratches. We use high waterproof adhesive on to backside of the pad. it lets you mount pad on polisher plate tightly and smoothly. We have a Heat-Pressing patented technology, which enables our customers to make any pattern form on polishing pads. Some of our customers were used to make round arc or pane pattern on pad surface to enhance slurry flow and distribution for big size wafer polishing. Typical method making patterns on polishing pads is mechanical cutting. However, this leaves some little scraps in round arc or pane channel and have a sharp channel edge, all of these will cause scratches on the wafer surface. With our patented heat pressing method there will be no scraps and the resulting round channel edge will eliminate scratches on the wafer surface. As well known scratch is a typical defect for InP polishing which is difficult to prevent. With our polishing pads you will enjoy higher polishing yield.
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